La piastra di stampa deve essere mantenuta a temperatura ambiente o a 40-50 °C. Peso: 0,75 kg.
| SUGGESTED PRINT SETS (1) |
| Suggested print sets | unit | value | test method |
| extruder temp | C° | 240°-270° | internal |
| plate temp | C° | 50°-80° | internal |
| min. nozzle diameter (2) | mm | 0,4 | internal |
| fan | % | 0-10 | internal |
| print speed | mm/1° | 40 | internal |
| PROPERTY |
| Physical | | | |
| Specific gravity | g/cm3 | 1,2 | ISO 1183 |
| Water absorption at equilibrium | % | <0,3 | 23°C / 24 h |
| Linear mould shrinkage | % | 0,3-0,5 | DIN 16901 |
| Mechanical at 23°C / 50% rh | | | |
| Tensile strength | MPa | 85 | ISO 527 |
| Elongation at maximum force | % | 3,5 | ISO 527 |
| Modulus of elasticity | GPa | 3 | ISO 527 |
| Thermal | | | |
| Heat distortion temp. | °C | 90 | ISO 75 |
| Continuous service temp. | °C | 120 | UL 746B |
| Maximum (short term) use temp. | °C | 136 | - |
| Coefficient of thermal expansion | 10-5/K | 0,5 | DIN 52752 |
| Thermal conductivity | W/mK | 0,3 | HOT-DISK |
| Electrical | | | |
| Insulation resistance | Ω | ≤1012 | DIN/IEC 60167 |
| Surface resistance | Ω | ≤1012 | DIN IEC 60093 |
