This product is perfectly suited to high-end mechanical applications, due to its high tensile modulus. The filament's hygroscopic properties are so low that it is no longer necessary to dry it before use.Weight: 0.75 kg.
No support file available
| SUGGESTED PRINT SETS (1) |
| Suggested print sets | unit | value | test method |
| extruder temp | C° | 240°-270° | internal |
| plate temp | C° | 50°-80° | internal |
| min. nozzle diameter | mm | 0,5 | internal |
| fan | % | 0-10 | internal |
| print speed | mm/1° | 35 | internal |
| PROPERTY |
| Physical | | | |
| Specific gravity | g/cm3 | 1,25 | ISO 1183 |
| Water absorption at equilibrium | % | <0,3 | 23°C / 24 h |
| Mechanical at 23°C / 50% rh | | | |
| Tensile strength | MPa | 170 | ISO 527 |
| Elongation | % | 2 | ISO 527 |
| Modulus of elasticity | GPa | 15 | ISO 527 |
| Charpy impact strength | kJ / m2 | 47 | ISO 179 1eU |
| Thermal | | | |
| Heat distortion temp. | °C | 240 | ISO 75 |
| Continuous service temp. | °C | 150 | UL 746B |
| Maximum (short term) use temp. | °C | 180 | - |
| Coefficient of thermal expansion | 10-5/K | 0,4 | DIN 52752 |
| Thermal conductivity | W/mK | 1 | HOT-DISK |
| Electrical | | | |
| Insulation resistance | Ω | ≤102 | DIN/IEC 60167 |
| Surface resistance | Ω | ≤102 | DIN IEC 60093 |